GCR Technical Staffing
Bloomington, IN, USA
Job Description Die Level Electronics Packaging Engineer Bloomington IN area 12+ month Contract Seeking subject matter expertise and proven execution capability in high-density die-level electronics packaging. The position requires skills in design, fabrication, and assembly of integrated multi-die electronic systems for research, commercial, and national defense applications. Experience in a research laboratory or industrial environment and excellent communication and analytical skills are required. A successful applicant will have expertise in electronics packaging technology and the ability to reduce 2.5- and 3-D integration technologies to practice in a low rate production environment. Expertise can include design and process development for electronics and MEMS packaging, wafer-scale electronics integration, thin film systems processing, metallurgy, and microscale metrology. System design and experience on multidisciplinary team including vendors and external technologies is...